Now is your time, your opportunity. ÌÇÐÄÔ´´ is the place to make it happen.
It all starts with the FREE* application process.
To be considered for admission, submit these two items:
- Application for Undergraduate Admission. Submit your FREE* application using the ÌÇÐÄÔ´´ application or the Common Application.
- Official high school transcript
- Partial transcript due at time of application. Final transcript, with graduation date posted, due upon completion of your senior year.
Application materials should be submitted to:
ÌÇÐÄÔ´´
Office of Undergraduate Admissions
3640 Colonel Glenn Hwy.
Dayton, OH 45435-0001
Note: High school students who have earned credit for college courses through Ohio’s College Credit Plus, Advanced Placement, International Baccalaureate, or a dual enrollment program, must submit official transcripts after the completion of these courses. High school students do not need to submit college transcripts for ÌÇÐÄÔ´´ to make an admission decision.
Important Dates and Deadlines
Recommended Admissions Criteria
High school graduates who complete the Ohio Core Curriculum (or equivalent rigorous curriculum) and maintain at least a 2.0 cumulative high school GPA will be considered for admission. Applications will be evaluated in a holistic review process.
All applicants, including test-optional applicants, will be eligible to be considered for University benefits, including merit-based scholarships. At the current time, applications will be reviewed holistically.
You will automatically be considered for merit-based scholarships by submitting your application for admission. To be considered for need-based financial aid, please complete the FAFSA. In addition, you may choose to apply for additional scholarships through our competitive scholarship application.
Recommended High School Course Work for Admission
- 4 years English
- 4 years Mathematics
- 3 years Science
- 3 years of Social Studies
Ohio applicants should take and earn a minimum of 20 credits and meet all course requirements for Ohio's Graduation Requirements.